tem micrograph meaning in English

透射电子显微镜显微照片

2 structure measurement of multi - wall carbon nanotubes after ball milling . the long cnts has been shorted by commen ball milling and effect of time on cnts has researched . the mechanism of cut has been analyzed . 3 the research of adsorption of mnoa by cnts , the tem micrograph of cnts and mechanism were analyzed
2多壁碳纳米管球磨后的结构表征，采用低速球磨机，使碳纳米管变短，澎器掀蕊研究了球磨时间对碳纳米管的影响，对其断裂机制作了定性分析。
For xrd , ellipsometry examinations , single - side - polished si ( lll ) wafers were used as substrates and for resistance measurement , glass was used and for infrared examination , double - side - polished si ( lll ) wafers were used and for ultraviolet - visible spectrophotometry , double - side - polished quartz wafers were used and for tem micrograph and electron diffraction pattern observation , cu nets deposited by formvar film were used . the cu - mgf2 cermet films were from 50 to 600nm thick
用于xrd分析、椭偏测量的单抛si ( 111 )晶片和电阻测试的载玻片上淀积膜厚约为600nm ；用于ir测试的双抛si ( 111 )晶片和uv测试的石英玻璃片上淀积膜厚约为250nm ；用于透射电镜分析的样品则淀积在400目铜网上的支撑formvar膜上，膜厚约为50 100nm 。